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Apple iPhone 7s, 7s Plus and iPhone 8 moulds leaked in an image

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In past few months, there have been several leaked images and renders showing the design of the upcoming Apple iPhone 8. While some show horizontal rear camera setup, others show a vertical setup. Now, some new leaked images claim to show the moulds of all three alleged upcoming iPhone models — iPhone 8, iPhone 7s and the iPhone 7s Plus.

The leaked images come courtesy from Chinese microblogging website Weibo and have been shared by Slashleaks. The images show the back panel designs of the three devices. From the looks of it, the iPhone 7s Plus could be the tallest in height, followed by iPhone 8 and iPhone 7s (shortest one).

It is also seen that the iPhone 7s Plus will follow the iPhone 7 Plus design and will carry a horizontal dual rear camera setup. The iPhone 7s will sport a single rear camera like its predecessor. The iPhone 8 however, could sport a vertical dual rear camera setup. In addition, while there’s a separate pit for the LED flash modules in the iPhone 7s Plus and the iPhone 7s, there is no LED flash enclosure seen in the iPhone 8 mould. This could also mean that the vertical camera setup could include the LED flash as well.

The image also shows an opening below the spot where we usually see the Apple logo, indicating that all three could feature a rear fingerprint sensor. If true this will be one of the major design changes from the last year.

Nothing else has been revealed in the images. Although these design resemble the previous leaks and rumours, they can be used for dummy purposes and the final output may change.

Apple Watch with ‘wearable, rollable, and foldable displays’ may be in works

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Recent report from Digitimes claim that the Apple’s A11 processor, which is said to power the upcoming smartphone, has entered into mass production . Taiwanese Semiconductor Manufacturing Company (TSMC) has started producing the SoCs.

According to previous reports, TSMC wanted to commence the production of A11 processors last month itself but was not able to do due to yield issues. The report also claims that TSMC will be the sole supplier of A11 chipsets this year for the new iPhone handsets. The new processor, besides the rumoured iPhone 8, will also be powering the upcoming successors of the iPhone 7 and the iPhone 7 Plus.

APPLE IPHONE 8 SPECIFICATIONS

SUMMARY
performance Quad core
display 5.0″ (12.7 cm)
storage 32 GB
camera 12 MP
battery 2350 mAh
ram 4 GB
SPECIAL FEATURES
fingerprint sensor position Front
other sensors Light sensor, Proximity sensor, Accelerometer, Barometer, Compass, Gyroscope
fingerprint sensor Yes
GENERAL
quick charging Yes
operating system iOS v10
sim slots Single SIM, GSM
model iPhone 8
launch date August 5, 2017 (Unofficial)
brand Apple
sim size SIM1: Nano
network 4G: Available (supports Indian bands) 3G: Available, 2G: Available
fingerprint sensor Yes
MULTIMEDIA
fm radio No
audio jack 3.5 mm
PERFORMANCE
chipset Apple A11
processor Quad core, 2.5 GHz
architecture 64 bit
ram 4 GB
DESIGN
build material Case: MetalBack: Metal
waterproof Yes Water resistant
DISPLAY
display type OLED
pixel density 441 ppi
screen size 5.0 inches (12.7 cm)
screen resolution Full HD (1080 x 1920 pixels)
touch screen Yes Capacitive Touchscreen, Multi-touch
STORAGE
internal memory 32 GB
expandable memory Yes Up to 256 GB
CAMERA
settings Exposure compensation, ISO control
aperture 2.2 F
camera features 10 x Digital Zoom, 2 x Optical Zoom, Auto Flash, Face detection, Simultaneous HD video and image recording, Touch to focus
image resolution 4608 x 2592 Pixels
sensor Back-illuminated sensor (BSI)
autofocus Yes
shooting modes Continuos Shooting, High Dynamic Range mode (HDR), Burst mode
resolution 7 MP Front Camera
optical image stabilisation Yes
flash Yes Retina Flash
video recording 1920×1080 @ 30 fps
BATTERY
user replaceable No
quick charging Yes
wireless charging Yes
type Li-ion
capacity 2350 mAh
NETWORK CONNECTIVITY
wifi Yes Wi-Fi 802.11, a/ac/b/g/n/n 5GHz
wifi features Mobile Hotspot
bluetooth Yes v4.2
volte Yes
usb connectivity USB 2.0
nfc Yes
network support 4G (supports Indian bands), 3G, 2G
gps Yes with A-GPS, Glonass
sim 1 4G Bands:TD-LTE 2300(band 40) FD-LTE 1800(band 3)3G Bands: UMTS 1700 / 1900 / 2100 / 850 / 900 MHz2G Bands: GSM 1800 / 1900 / 850 / 900 MHz 4G Speed: 50 Mbit/s ? 450 Mbit/s ? (LTE category 9)3G Speed: HSDPA 42.2 Mbit/s ?, HSUPA 5.76 Mbit/s ?GPRS:Available EDGE:Available
sim size SIM1: Nano

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